Cooper Bussmann
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Headquarters Contact Information Name: Judy Simms-Brown Address: PO Box 14460
St. Louis
MO 63178-4460
Local Contact Information Dale P. Missey Technical Sales Engineer 707 Harlequin Way Canton, GA 30115 Mobil: 404-550-9883 Fax: 636-207-3648 email: dmissey@cooperbussmann.com
Year Established: 1914
Total Personnel: The company employs more than 4000 electrical, mechanical, application and sales engineers; manufacturing and support personnel worldwide.
Staff
Kevin Stein, President
Project
Types Industrial Commercial Telecom Automotive
Examples of Projects Busch Stadium, St. Louis Edward Jones Dome, St. Louis John Hancock Building, Chicago Hydroelectric Station at Itaipu, Brazil Power supply for MIT plasma fusion center, Cambridge |
About the Company Cooper Bussmann sets the standard for circuit protection in the global market place with its 89-year history of innovation. Cooper Bussmann manufactures over 50,000 types of North American and European–styled fuses to protect electrical, electronic and automotive systems around the globe. Cooper Bussmann also offers inductors and transformers designed to provide power quality in electronics applications. Division headquarters: St. Louis, Missouri USA Corporate headquarters: Houston, Texas USA Historical Perspective: 1914 Bussmann is founded by brothers Al, Harry, Frank, Joe and Lee Bussmann in St. Louis, Missouri. 1929 Bussmann is acquired by Max McGraw, later to become McGraw Edison. The Bussmann family remains active. 1985 McGraw Edison is acquired by Cooper Industries, Inc., headquartered in Houston, Texas. 1993 Bussmann opens the Paul Gubany Center for High Power Technology. Patent History: Cooper Bussmann has been awarded more than 3000 utility and design patents throughout its history, with more than 150 patents currently active. 1923 Henry is awarded the company’s first two patents, for cartridge and electric fuses. 1924 Frank receives a patent for a portable electric lamp. 1929 FUSETRON fuse technology is patented. 1963 Bussmann receives a patent for its Class J time delay fuse design. 1967 the first of the LOW-PEAK fuse product line is introduced. 1992 the patented LPCC midget time delay fuse is introduced. 1993 Bussmann receives a patent for the first surface mount chip fuse for printed circuit board applications. 2000 the new CUBEFuse finger-safe, compact fuse package receives five patents. Customer Contact: Dale Missey
Supplier Contact: Tower Sales - Phone - 770-448-1406 |